Transactions of Nanjing University of Aeronautics & Astronautics
Numerical Simulation and Experimental Verification of Temperature Distribution of Piezoelectric Stack with Heating and Thermal Insulation Device
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Abstract:
This paper discusses the temperature field distribution of piezoelectric stack with heating and thermal insulation device in cryogenic temperature environment. Firstly， the model of the piezoelectric damper is simplified and established by using partial-differential heat conduction equation. Secondly， the two-dimensional Du Fort-Frankel finite difference scheme is used to discretize the thermal conduction equation， and the numerical solution of the transient temperature field of piezoelectric stack driven by heating film at different positions is obtained by programming iteration. Then， the cryogenic temperature cabinet is used to simulate the low temperature environment to verify the numerical analysis results of the temperature field. Finally， the finite difference results are compared with the finite results and the experimental data in steady state and transient state， respectively. Comparison shows that the results of the finite difference method are basically consistent with the finite element and the experimental results， but the calculation time is shorter. The temperature field distribution results obtained by the finite difference method can verify the thermal insulation performance of the heating system and provide data basis for the temperature control of piezoelectric stack.
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Clc Number:
TP391
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