Transactions of Nanjing University of Aeronautics & Astronautics
Numerical Analysis for High-Throughput Elastic Modulus Measurement of Substrate-Supported Thin Films
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Abstract:
Micro/nano-thin films are widely used in the fields of micro/nano-electromechanical system （MEMS/NEMS） and flexible electronics， and their mechanical properties have an important impact on the stability and reliability of components. However， accurate characterization of the mechanical properties of thin films still faces challenges due to the complexity of film-substrate structure， and the characterization efficiency of traditional techniques is insufficient. In this paper， a high-throughput determination method of the elastic modulus of thin films is proposed based on the strain variance method， the feasibility of which is analyzed by the finite element method （FEM）， and the specific tensile configuration with array-distributed thin films is designed and optimized. Based on the strain difference between the film-substrate region and the uncoated region， the elastic modulus of multiple films is obtained simultaneously， and the influences of film width， spacing， thickness， and distribution on the measurement of elastic modulus are elucidated. The results show that the change in film width has a more obvious effect on the elastic modulus determination than film spacing and thickness， i.e.， the larger the film width is， the closer the calculation results are to the theoretical value， and the change in calculation results tends to be stabilized when the film width increases to a certain length. Specifically， the simultaneous measurement of the elastic modulus of eight metal films on a polyimide （PI） substrate with a length of 110 mm and a width of 30 mm can be realized， and the testing throughput can be further increased with the extension of the substrate length. This study provides an efficient and low-cost method for measuring the elastic modulus of thin films， which is expected to accelerate the development of new thin film materials.
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O13
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